JPH0184445U - - Google Patents
Info
- Publication number
- JPH0184445U JPH0184445U JP1987180506U JP18050687U JPH0184445U JP H0184445 U JPH0184445 U JP H0184445U JP 1987180506 U JP1987180506 U JP 1987180506U JP 18050687 U JP18050687 U JP 18050687U JP H0184445 U JPH0184445 U JP H0184445U
- Authority
- JP
- Japan
- Prior art keywords
- case
- cover
- housing
- semiconductor element
- connecting blades
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180506U JPH0184445U (en]) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180506U JPH0184445U (en]) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184445U true JPH0184445U (en]) | 1989-06-05 |
Family
ID=31472023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180506U Pending JPH0184445U (en]) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184445U (en]) |
-
1987
- 1987-11-27 JP JP1987180506U patent/JPH0184445U/ja active Pending